Method and structure for interconnection

ABSTRACT

The present disclosure provides a method of fabricating a semiconductor structure in accordance with some embodiments. The method includes forming a first low-k dielectric layer over a substrate; forming a first and second metal features in the first low-k dielectric layer; forming a first trench in the first low-k dielectric layer, the first trench spanning between the first and second metal features; performing a ultraviolet (UV) treatment to sidewalls of the first low-k dielectric layer in the first trench; forming a first etch stop layer in the first trench; and depositing a second low-k dielectric layer on the first etch stop layer, thereby forming an air gap in the first trench.

PRIORITY DATA

This application claims the benefit of U.S. Prov. App. No. 62/272,414entitled “Method and Structure for Interconnection,” filed Dec. 29,2015, herein incorporated by reference in its entirety.

BACKGROUND

The semiconductor integrated circuit (IC) industry has experienced rapidgrowth. Technological advances in IC materials and design have producedgenerations of ICs where each generation has smaller and more complexcircuits than the previous generation. However, these advances haveincreased the complexity of processing and manufacturing ICs and, forthese advances to be realized, similar developments in IC processing andmanufacturing are needed. In the course of integrated circuit evolution,functional density (i.e., the number of interconnected devices per chiparea) has generally increased while geometry size (i.e., the smallestcomponent (or line) that can be created using a fabrication process) hasdecreased.

ICs may include electronic components, such as transistors, capacitors,or the like, formed on a substrate. Interconnect structures, such asvias and conductive lines, are then formed over the electroniccomponents to provide connections between the electronic components andto provide connections to external devices. To reduce the parasiticcapacitance of the interconnect structures, the interconnect structuresmay be formed in dielectric layers including a low-k dielectricmaterial. In the formation of the interconnect structures, the low-kdielectric material may be etched to form trenches and via openings.However, the etching of low-k dielectric may cause damages to the low-kdielectric material, which leads to leakage issues. Accordingly, what isneeded is a circuit structure and a method making the same to addressthe above issues.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1 is a flowchart illustrating an embodiment of a method of forminga semiconductor device or portion thereof according to one or moreaspects of the present disclosure.

FIGS. 2, 3A, 4, 5A, 5C, 6, 11, 12A, 12B, 13A and 13B are cross-sectionalviews of a semiconductor structure at various fabrication stagesconstructed according to some embodiments.

FIGS. 3B, 5B and 12C are top views of a semiconductor structure atvarious fabrication stages constructed according to some embodiments.

FIG. 7 is a schematic view of a semiconductor fabrication system,constructed according to some embodiments.

FIG. 8 is a diagram illustrating spectrums of the UV sources of thesemiconductor fabrication system in FIG. 7 according to someembodiments.

FIG. 9 is a diagram illustrating powers of the UV sources of thesemiconductor fabrication system in FIG. 7 according to someembodiments.

FIG. 10 is a diagram illustrating a carbon concentration profile of alow-k dielectric layer of the semiconductor structure in FIG. 6according to some embodiments.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

Referring now to FIG. 1, illustrated therein is a flowchart of oneembodiment of a method 100 used to fabricate a semiconductor structure.FIG. 2 is a sectional view of a semiconductor structure 200 duringvarious fabrication stages and constructed according to various aspectsof the present disclosure in one or more embodiments. The method 100 andthe IC structure 200 are collectively described below with reference toFIGS. 1, 2 and other figures.

The method 100 includes an operation 102 to form metal features on asemiconductor substrate 202. The semiconductor substrate 202 includessilicon. Alternatively or additionally, the substrate 202 may includeother elementary semiconductor such as germanium. The substrate 202 mayalso include a compound semiconductor such as silicon carbide, galliumarsenic, indium arsenide, and indium phosphide. The substrate 202 mayinclude an alloy semiconductor such as silicon germanium, silicongermanium carbide, gallium arsenic phosphide, and gallium indiumphosphide. In one embodiment, the substrate 202 includes an epitaxiallayer. For example, the substrate may have an epitaxial layer overlyinga bulk semiconductor. Furthermore, the substrate 202 may include asemiconductor-on-insulator (SOI) structure. For example, the substratemay include a buried oxide (BOX) layer formed by a process such asseparation by implanted oxygen (SIMOX) or other suitable technique, suchas wafer bonding and grinding. The substrate 202 also includes variousp-type doped regions and/or n-type doped regions, implemented by aprocess such as ion implantation and/or diffusion. Those doped regionsinclude n-well, p-well, light doped region (LDD), heavily doped sourceand drain (S/D), and various channel doping profiles configured to formvarious integrated circuit (IC) devices, such as a complimentarymetal-oxide-semiconductor field-effect transistor (CMOSFET), an imagingsensor, a light emitting diode (LED), various memory devices, or acombination thereof. The substrate 202 may further include otherfunctional features such as a resistor or a capacitor formed in and onthe substrate. The substrate 202 further includes lateral isolationfeatures provided to separate various devices formed in the substrate202. In one embodiment, shallow trench isolation (STI) features are usedfor lateral isolation.

In some embodiments, the substrate 202 is not a flat and has a threedimensional profile of the active regions, such as a fin-like activeregion. The fin-like active region extended above the STI features. Theformation of the fin-like active region includes forming STI features inthe substrate, and then recessing the STI features by selective etch orgrowing the active region by selective epitaxy growth (SEG). A fieldeffect transistor formed on the fin-like active region is also referredto as a fin FET (FinFET).

In FIG. 2, illustrated is an exemplary field effect transistor 204 thatincludes a source 204A, a drain 204B, and a gate stack 204C interposedbetween the source and drain. Another exemplary device or structure 206is schematically shown in FIG. 2. The semiconductor device 206 formed inor on the substrate 202 may include active components such as FETs orBipolar Junction Transistors (BJTs), or passive components such asresistors, capacitors, or inductors. The semiconductor structure 200 mayinclude millions or billions of these semiconductor devices, but only afew are shown in FIG. 2 for the sake of simplicity.

A plurality of dielectric layers and conductive features may beintegrated to form an interconnection structure configured to couple thevarious p-type and n-type doped regions and the other functionalfeatures (such as gate electrodes), resulting in a functional integratedcircuit. The interconnection structure includes a multi-layerinterconnect (MLI) structure and an inter-level dielectric (ILD)integrated with the MLI structure, providing an electrical routing tocouple various devices in the substrate 202 to the input/output powerand signals. The interconnection structure includes various metal lines,contacts and vias (or via plugs). The metal lines provide horizontalelectrical routing. The contacts provide vertical connection between thesubstrate and metal lines while via features provide vertical connectionbetween metal lines in different metal layers.

In the present example, the semiconductor structure 200 may include aportion 208 (a subset) of the interconnection structure, such as one ortwo metal layers. In the flowing description, the portion 208 of theinterconnection structure is simply referred to as interconnectionstructure 208. As illustrated in the example of FIG. 2, in someembodiments, the interconnect structure 208 is formed over the substrate202. The interconnect structure 208 includes a plurality of patterneddielectric layers and connective layers that provide interconnections(e.g., wiring) between the various doped features, circuitry, andinput/output of the semiconductor structure 200. For example, theinterconnect structure 208 includes an interlayer dielectric (ILD) 210and various conductive features formed in the ILD. The ILD 210 mayinclude silicon oxide, low-k dielectric material, other suitabledielectric materials, or combinations thereof. For purposes ofillustration, the interconnection structure 208 includes contacts 212,metal lines 214 and vias 216 coupled to various devices on the substrate202. It is noted that the contacts 212, conductive lines 214 and vias216 illustrated are merely exemplary, and the actual positioning,quantity, and configuration of the conductive lines and contacts/viasmay vary depending on design and manufacturing needs. Theinterconnection structure 208 includes conductive lines formed bysuitable methods including physical vapor deposition (PVD), chemicalvapor deposition (CVD), atomic layer deposition (ALD), plating,sputtering, other suitable processes and a combination thereof. Theinterconnection structure 208 may be defined by suitable processes suchas photolithography and etching processes. The conductive lines and/orvias of the interconnection structure 208 may include multiple layerssuch as, barrier layers, seed layers, adhesion layers, and/or othersuitable features. In some embodiments, the interconnection structure208 includes conductive lines 214 of copper. Other suitable compositionsfor the interconnection structure 208 includes aluminum,aluminum/silicon/copper alloy, metal silicide (such as nickel silicide,cobalt silicide, tungsten silicide, tantalum silicide, titaniumsilicide, platinum silicide, erbium silicide, palladium silicide, orcombinations thereof), copper alloy, titanium, titanium nitride,tantalum, tantalum nitride, tungsten, polysilicon, gold, silver, and/orcombinations thereof. The formation of the metal lines 214 may include adamascene process, such as single damascene or dual damascene. In someembodiments, the formation of the metal lines may include a proceduresimilar to that used in this method to form metal lines in the overlyingmetal layer, which will be described later.

A dielectric layer 220 is formed on the substrate 202. In someembodiments, the dielectric layer 220 includes an etch stop layer 222and a low-k dielectric layer 224 formed over the substrate 202, such ason the interconnection structure 208. In some embodiments, the etch stoplayer 222 is disposed over the interconnect structure 208.Alternatively, the interconnect structure 208 may be omitted in thesemiconductor structure 200, and the etch stop layer 222 may be formeddirectly over the substrate 202. The etch stop layer 222 may include adielectric material, such as silicon nitride, silicon oxynitride,silicon carbide, other suitable materials, and/or a combination thereof.In some examples, the etch stop layer 222 may include multiple layers,such as a silicon nitride layer, a silicon carbon nitride layer, asilicon oxynitride layer, other suitable layers, and/or a combinationthereof.

The low-k dielectric layer 224 is formed over the etch stop layer 222.The low-k dielectric layer 224 may be formed by depositing a low-kdielectric material over the etch stop layer 222. Low-k materials mayinclude dielectric materials that have a dielectric constant (k) lowerthan that of SiO₂ (e.g., 3.9). The low-k dielectric material may includecarbon containing materials, organo-silicate (OSG) glass,porogen-containing materials, a hydrogen silsesquioxane (HSQ) dielectricmaterial, a methylsilsesquioxane (MSQ) dielectric material, a carbondoped oxide (CDO) dielectric material, a hydrogenated siliconoxy-carbide (SiCOH) dielectric material, a benzocyclobutene (BCB)dielectric material, an arylcyclobutene based dielectric material, apolyphenylene based dielectric material, other suitable materials,and/or a combination thereof.

In various embodiments, the low-k dielectric layer 224 may be depositedusing a chemical vapor deposition (CVD) method, plasma enhanced CVD(PECVD), low pressure CVD (LPCVD), atomic layer chemical vapordeposition (ALCVD), spin-on coating, and/or other suitable depositionprocesses. In some embodiments, the low-k dielectric layer 224 may havea thickness between 20 nm and 200 nm. In some embodiments, the height isbetween 40 nm and 60 nm.

In the operation 102, metal features 300 are formed in the dielectriclayer 220, as illustrated in FIG. 3A. In FIG. 3A, three exemplary metalfeatures 300A, 300B and 300C are illustrated. In some embodiments, themetal features are metal lines in an overlying metal layer. FIG. 3B is atop view of the semiconductor structure 200 in portion, constructed inaccordance with some embodiments. FIG. 3A is the sectional view of FIG.3B along the dashed line AA′. In the present embodiment, the metal lines300 are spaced away from each other in X direction and are orientedalong Y direction.

Similarly, the formation of the metal features 300 may includepatterning the dielectric layer 224 to form trenches in the dielectriclayer 224; filling the trenches with a metal material; and performing achemical mechanical polishing (CMP) process to planarize the top surfaceand remove the excessive metal material. In some embodiments, thepatterning process includes forming a patterned resist layer; andetching the underlying material layer using the patterned resist layeras an etch mask. The patterned resist layer may be removed afterward.The patterned resist layer is formed by a lithography process that mayinclude coating a resist layer; exposing the resist layer by a radiation(such as ultraviolet radiation); post exposure baking and developing.The lithography processes described above may only present a subset ofprocessing steps associated with a lithography patterning technique. Thelithography process may further include other steps such as cleaning andbaking in a proper sequence.

Similar to the metal lines 214, the metal features 300 may includecopper, aluminum, tungsten, other suitable metal or metal alloy or acombination thereof. The metal features 300 may include multiple layers,such as a barrier layer 302 lining in the trenches and a bulky metal 304filled in the lined trenches. The barrier layer 302 may includetitanium, titanium nitride, tantalum, tantalum nitride or a combinationthereof. In some examples, the barrier layer 302 is deposited by PVD,ALD or other suitable technique. In some other examples, the bulky metal304 is deposited by a procedure that includes plating to form a seedlayer, and plating to further deposit on the seed layer, thereby fillingthe trenches.

Referring back to FIGS. 1 and 4, the method 100 may include an operation104 to form an etch stop layer 400 on the dielectric layer 220. The etchstop layer 400 is designed with a composition and a thickness to protectthe metal features 300 formed in the dielectric layer 220 during variousfollowing operations, such as etching. In some examples, the etch stoplayer 400 may include multiple films. The etch stop layer 400 mayinclude a dielectric material, such as silicon nitride, siliconoxynitride, silicon carbide, other suitable materials, and/or acombination thereof.

Referring to FIGS. 1 and 5A, the method 100 proceeds to an operation 106to form one or more trench 500, such as two exemplary trenches 500A and500B, in the dielectric layer 220. Various features in the substrate 202and the interconnection structure 208 are eliminated in FIGS. 5A and 5Bfor better view. The formation of the trenches 500 includes patterningthe etch stop layer 400 to form an opening 502 by a lithographypatterning process; and etching the dielectric layer 220 to form thetrenches 502. In the present embodiment, the patterned etch stop layer400 is used as an etch mask during the etching process. In someembodiments, the etching process includes a dry etching process using afluorine-containing etchant and a wet etching process using a suitableetchant. For examples, the dry etching process is applied to etch thelow-k dielectric layer 224, using the fluorine-containing etchant, suchas C_(x)F_(y), where x and y are proper integers. For example,C_(x)F_(y) is CF₄. The etchant in the dry etching process mayadditionally include oxygen. The etchant of the wet etching processincludes hydrofluoric acid (HF), such as a solution of HF, H₂O₂ and H₂O.In some embodiments, the wet etching process may be designed to openingthe etch stop layer 222 and may include an etchant that selectivelyetches the etch stop layer 222. For examples, the etchant of the wetetching process includes hydrofluoric acid for the etch stop layer 222of silicon oxide or phosphorous acid for the etch stop layer 222 ofsilicon nitride.

FIG. 5B is a top view of the semiconductor structure 200 in portion,constructed in accordance with some embodiments. FIG. 5A is a sectionalview of FIG. 5B along the dashed line AA′. FIG. 5C is a sectional viewof FIG. 5B is along the dashed line BB′. The opening 502 exposes one ormore regions of the dielectric layer 220 between adjacent metal features300. Taking the trench 500A as an example, the trench 500A spans fromthe metal features 300A to the metal feature 300B along the X directionand spans from the sidewall 504A to the sidewall 504B of the low-kdielectric layer 224 along the Y direction. X and Y are orthogonal toeach other.

However, the etching process (such as wet etching or dry etching) maycause damage to the low-k dielectric layer 224 and reduce the carboncontent of the low-k dielectric layer 224. For example, the dry etchingremoves and reduces the carbon content of the low-k dielectric layer 224and the wet etching forms Si—OH bonding. The low carbon content leads toH₂O and increases the dielectric constant of the low-k dielectric layer.Especially, the sidewalls 504A and 504B of the dielectric layer 220 aredamaged, thereby rendering the low-k dielectric layer 224 to leakageissue, such as leakage between the metal features 300A and 300B throughthe damaged sidewalls.

Referring back to FIGS. 1 and 6, the method 100 proceeds to an operation108 to perform a treatment process 600 to the low-k dielectric layer224, particularly the sidewalls of the low-k dielectric layer 224. Inthe present embodiment, the treatment process 600 includes anultraviolet (UV) treatment. In some embodiments, the treatment processmay include an UV treatment process, an e-Beam treatment process, athermal treatment, other suitable treatment process, and/or acombination thereof.

In some embodiment, the UV treatment includes irradiating an UVradiation on to the sidewalls of the first low-k dielectric layer; andsupplying a first gas containing a CH₃ chemical group to the first low-kdielectric layer during the irradiating of the UV radiation. In thepresent example, the first gas containing the CH₃ chemical groupincludes a gas selected from the group consisting of a methylsilane(SiCH₆), dimethylsilane (SiC₂H₈), a trimethylsilan (SiC₃H₁₀), atetramethylsilane (SiC₄H₁₂) and a combination thereof. In some examples,the UV treatment additionally includes supplying a second gas to carryon the first gas to the sidewalls of the first low-k dielectric layer.The second gas is an inert gas, such as nitrogen or argon. In someembodiment, the UV treatment includes irradiating an UV radiation to thesidewalls (504A and 504B) of the first low-k dielectric layer 224 froman UV radiation source having a spectrum to effectively break Si—CH₃bond (of the first gas) and O—H bond of the low-k dielectric layer 224.

The treatment process may be performed in a production tool that is alsoused for PECVD, atomic layer deposition (ALD), LPCVD, etc. Referring tothe example of FIG. 7, in some embodiments, a UV treatment process isperformed to the low-k dielectric layer 224 in an UV treatment apparatus700. The UV treatment apparatus 700 includes a processing chamber 702and a substrate stage 704 configured in the processing chamber 702. Thesubstrate stage 704 is operable to secure a semiconductor wafer 705,such as the semiconductor structure 200, and rotates the semiconductorwafer 705 secured thereon.

The UV treatment apparatus 700 includes an UV source to irradiate thelow-k dielectric layer 224 with UV radiation. The UV source may be asingle excimer lamp or a broad spectrum source with arc or microwaveexcitations. In some embodiments, a filter may be used to selectivelyremove undesired wavelengths from the UV radiation. In some embodiments,the UV source includes a single UV source with a spectrum to effectivelybreak Si—CH₃ bond and O—H bond. In some embodiments, the UV sourceincludes two or more UV sources, such as UV sources 706A and 706B withdifferent spectrums. For example, the UV source 706A has a firstspectrum to effectively break Si—CH₃ bond from the first gas and the UVsource 706B has a second spectrum to effectively break O—H bond. Infurtherance of the embodiments, the first UV source 706A has a firstspectrum 802 and the second UV source 706B has a second spectrum 804, asillustrated in FIG. 8. The first spectrum 802 has a peak at a firstcentral frequency f1 and the second spectrum 804 has a peak at a secondcentral frequency f2 different from the first central frequency f1, suchas greater than f1. For example, the photon energy h*f1 at the firstcentral frequency f1 is about or greater than the bond energy of theSi—CH₃ bond, such as about 310 KJ/mol for Si—C bond energy of Si—CH₃;and the photon energy h*f2 at the second central frequency f2 is aboutor greater than the bond energy of the O—H bond, such as about 459kJ/mol.

In some embodiments, the UV irradiation may be performed in a vacuumenvironment or in an environment containing an inert gas, He, Ne, Ar,Kr, Xe, Rn, or a combination thereof. Referring back to FIG. 7, the UVtreatment apparatus 700 includes a first supply mechanism 708 coupled toa source of the first gas (containing CH₃ group) to provide the firstgas. In the present embodiment, the UV treatment apparatus 700 furtherincludes a second supply mechanism 710 coupled to a source of the secondgas (an inert gas) to provide the second gas. In the present embodiment,the UV treatment apparatus 700 also includes an exhaust mechanism 712,such as an air pump to remove the gases and maintain a proper pressurein the processing chamber 702. The UV treatment apparatus 700 may alsoinclude a controller 714 coupled with the UV sources 706A and 706B andis operable to control the powers of the UV sources for optimizedtreatment effect.

In some embodiments, the UV treatment process may be controlled (e.g.,by controlling the radiation wavelength(s), exposure time, powerintensity, temperature, pressure) so that the treated low-k dielectriclayer 224 has desired properties (e.g., increased carbon concentration).The controller 714 may control the powers of the UV sources 706A and706B dynamically over the treatment process. For example, as illustratedin FIG. 9, the first UV source 706A has a first power 902 at about asame level but the second UV source 706B has a second power 904increased over the treatment process 600 because more power is neededwhen the chemical reaction goes deeper from the sidewalls 504A and 504Bduring the UV treatment. The horizontal axis presents time of thetreatment process 600. In some example, the total time of the UVtreatment process ranges from 10 seconds to 60 seconds. In someexamples, the semiconductor structure 200 is heated to a hightemperature ranging between 200° C. and 400° C. during the UV treatment.The high temperature is caused by heating, UV irradiation or bothcollectively.

In some examples, the UV treatment conditions include a temperature ofbetween about 200° C. and about 400° C., and a process time of betweenabout 10 seconds and about 60 seconds. In a particular example, the UVtreatment process is performed in the processing chamber 702 pumped to apressure lower than 10⁻³ torr before applying the UV treatment.

Referring back to FIG. 6, the UV treatment process 600 recovers thecarbon loss of the low-k dielectric layer 224. As noted above, theetching process applied to the low-k dielectric layer 224 causes thecarbon loss and changes the low-k dielectric layer to be hydrophilic.This further causes water absorption to the low-k dielectric layer andrenders it conductive, leading to the leakage issues. The UV treatment600 introduces carbon to the low-k dielectric layer 224 from thesidewalls (504A and 504B) and increases the carbon content therein. In aparticular embodiment, as carbon is introduced from the sidewalls 504Aand 504B, the carbon concentration is graded in the low-k dielectriclayer 224 from the sidewalls to the bulky portion, such as from thesidewall 504B along the direction “T”, as illustrated in FIG. 6. This isfurther illustrated in FIG. 10. The horizontal axis represents adistance from the sidewall 504A and 504B (at “0” distance) to the bulkylow-k dielectric layer along “T” direction and the vertical axisrepresents the carbon concentration. The carbon concentration is higherat the sidewalls 504A and 504B; goes down to a dip at a location 1002away from the sidewalls 504A and 504B; and then increase to a carbonconcentration 1004 of the bulky portion of the low-k dielectric layer224.

Referring to FIGS. 1 and 11, the method 100 may proceed to an operation110 to form a dielectric layer 1102, such as an etch stop layer. Thedielectric layer 1102 may be similar to the etch stop layer 400 in termsof composition and deposition. For example, the dielectric layer 1102includes silicon oxide, silicon nitride, silicon oxynitride, othersuitable material or a multilayer of a combination thereof. Thedielectric layer 1102 has a thickness to control the proper formation ofair gap at later stage. In some examples, the dielectric layer 1102 hasa thickness ranging between 10 nm and 50 nm. In the present embodiment,the dielectric layer 1102 is conformal to the trench 500A.

Referring to FIGS. 1, 12A, 12B and 12C, the method 100 proceeds to anoperation 112 to form air gap 1202 in a second low-k dielectric layer1204. The operation 112 includes depositing a second low-k dielectriclayer 1204, such as by CVD. The deposition is tuned with deposition rateand profile such that the second low-k dielectric layer closes up whenfilling the trench 500, thereby forming the air gap 1202 surrounded bythe second low-k dielectric layer 1204 within the trench 500.

The operation 112 may further include a curing process applied to thesecond low-k dielectric layer 1204 after deposition. In variousembodiments, the curing process includes a thermal annealing, UVradiation or a combination thereof, such as UV assisted annealingprocess. The UV radiation at the operation 112 is different from the UVtreatment at the operation 108 in terms of functions, UV spectrum, powerand duration and gas supply. For example, the UV assisted annealingincludes using a monochromatic UV source with intensity maximum at λ1 nmand a broadband UV source with intensity spectrum distributed below λ2.After the deposition and curing, the operation 112 may further include aCMP process to planarize the top surface of the semiconductor structure200.

FIG. 12C is a top view of the semiconductor structure 200 in portion(only a portion from the metal feature 300A to the metal feature 300B),constructed in accordance with some embodiments. FIG. 12A is a sectionalview of the semiconductor structure 200 along the dashed line AA′ inFIG. 12C and FIG. 12B is a sectional view of the semiconductor structure200 along the dashed line BB′ in FIG. 12C. In FIG. 12C, the air gap 1202is surrounded by the second low-k dielectric layer 1204, which isfurther surrounded by the dielectric layer 1102 in the region(corresponding to the trench 500, also referred to as trench region)defined by the adjacent metal features 300 and the first low-kdielectric layer 224. This trench region spans from the metal feature300A to the metal feature 300B along the X direction and spans from thesidewall 504A to the sidewall 504B of the first low-k dielectric layer224 along the Y direction. Especially, the carbon concentration of thefirst low-k dielectric layer 224 is graded from the sidewall to thebulky portion, as described in FIG. 10.

The method 100 may include other operations before, during or after theabove operations. Referring to FIGS. 1 and 13A, the method 100 mayproceed to another operation 114 to form one or more metal feature onthe second low-k dielectric layer 1204. For example, a CMP process maybe applied to remove the second low-k dielectric layer 1204 and othermaterials (such as etch stop layers 400 and 1102) to expose the metalfeatures 300. The operation 114 includes forming a dielectric layer 1300that may include an etch stop layer 1302 and a third low-k dielectriclayer 1304 on the etch stop layer 1302. The operation 114 furtherincludes patterning the dielectric layer 1300 to form one or moretrench; filling a metal to the trench to form a metal feature 1306; andperforming a CMP process to remove the excessive metal and planarize thetop surface. The formation of the metal feature 1306 may be similar tothe formation of the metal features 300. The metal feature 1306 may be avia feature landing on the metal feature 300A and connects the metalfeature 300A to a metal line on the overlying metal layer. The metalfeature 1306 may include multiple layers, such as a barrier layer andbulky metal surrounded by the barrier layer. The operation 114 mayfurther include operations to form one or more air gap between adjacentmetal features 1306 in a procedure similar to the procedure to form theair gaps 1202.

Although not shown, other processing operations may be presented to formvarious doped regions such as source and drain regions and/or devicesfeatures such as gate electrode. In one example, the substrate mayalternatively include other material layer to be patterned by thedisclosed method, such as another patterned metal layer. In anotherexample, additional patterning steps may be applied to the substrate toform a gate stack. In another example, various metal features, such asmetal features 300, may include metal lines and via features formed by adual damascene process, such as one illustrated in FIG. 13B. In FIG.13B, the metal feature 300B is a metal line while the metal features300A and 300C includes metal lines and metal vias.

A semiconductor structure with an air gap and a method making the sameare disclosed. The method includes an UV treatment to the sidewalls ofthe first low-k dielectric layer 224 and the air gaps 1202 are formedbetween the treated sidewalls of the first low-k dielectric layer 224.The first low-k dielectric layer 224 has a graded carbon concentrationfrom the sidewalls 504A and 504B to the bulky portion of the first low-kdielectric layer 224. The UV treatment apparatus 700 may be used toimplement the UV treatment.

Various advantages may be present in various applications of the presentdisclosure. No particular advantage is required for all embodiments, andthat different embodiments may offer different advantages. One of theadvantages in some embodiments is that the carbon loss of the firstlow-k dielectric layer 224 is recovered and the leakage issue iseliminated.

Thus, the present disclosure provides a method of fabricating asemiconductor structure in accordance with some embodiments. The methodincludes forming a first low-k dielectric layer over a substrate;forming a first and second metal features in the first low-k dielectriclayer; forming a first trench in the first low-k dielectric layer, thefirst trench spanning between the first and second metal features;performing a ultraviolet (UV) treatment to sidewalls of the first low-kdielectric layer in the first trench; forming a first etch stop layer inthe first trench; and depositing a second low-k dielectric layer on thefirst etch stop layer, thereby forming an air gap in the first trench.

The present disclosure also provides a semiconductor in accordance withsome embodiments, The semiconductor structure includes a metal layerdisposed over a semiconductor substrate, wherein the metal layerincludes a first metal feature and a second metal feature oriented in afirst direction and spaced from each other in a second direction beingorthogonal to the first direction; a low-k dielectric layer disposedbetween first and second metal features and with sidewalls spaced fromeach other along the first direction; an etch stop layer disposed on thesidewalls of the low-k dielectric layer and on sidewalls of the firstand second metal features; and a second low-k dielectric layer formed onthe etch stop layer, defining an air gap being surrounded by the secondlow-k dielectric layer.

The present disclosure further provides a semiconductor fabricationapparatus in accordance with some embodiments. The semiconductorfabrication apparatus includes a processing chamber; a substrate stageconfigured in the processing chamber and designed to secure asemiconductor wafer; a first ultraviolet (UV) source configured in theprocessing chamber, wherein the first UV source is able to generate afirst UV irradiation with a first spectrum to effectively break Si—CH₃bond; a second UV source configured in the processing chamber, whereinthe second UV source is able to generate a second UV irradiation with asecond spectrum to effectively break O—H bond, wherein the secondspectrum is different from the first spectrum; and a chemical supplyconnected to the processing chamber and being operable to deliver a gascontaining a CH₃ chemical group to the processing chamber.

Although the present disclosure and advantages of some embodiments havebeen described in detail, it should be understood that various changes,substitutions and alterations can be made herein without departing fromthe spirit and scope of the disclosure as defined by the appendedclaims. Moreover, the scope of the present application is not intendedto be limited to the particular embodiments of the process, machine,manufacture, and composition of matter, means, methods and stepsdescribed in the specification. As one of ordinary skill in the art willreadily appreciate from the present disclosure, processes, machines,manufacture, compositions of matter, means, methods, or steps, presentlyexisting or later to be developed, that perform substantially the samefunction or achieve substantially the same result as the correspondingembodiments described herein may be utilized according to the presentdisclosure. Accordingly, the appended claims are intended to includewithin their scope such processes, machines, manufacture, compositionsof matter, means, methods, or steps.

What is claimed is:
 1. A method of fabricating a semiconductorstructure, comprising: forming a first low-k dielectric layer over asubstrate; forming a first and second metal features in the first low-kdielectric layer; forming a first trench in the first low-k dielectriclayer, the first trench spanning between the first and second metalfeatures; performing a ultraviolet (UV) treatment to sidewalls of thefirst low-k dielectric layer in the first trench; forming a first etchstop layer in the first trench; and depositing a second low-k dielectriclayer on the first etch stop layer, thereby forming an air gap in thefirst trench.
 2. The method of claim 1, wherein the forming of the firstand second metal features in the first low-k dielectric layer includespatterning the first low-k dielectric layer, thereby forming secondtrenches in the first low-k dielectric layer; filling the secondtrenches with a metal material; and performing a polishing to the metalmaterial, thereby forming the first and second metal features.
 3. Themethod of claim 1, wherein the forming the first trench in the firstlow-k dielectric layer includes forming, on the first low-k dielectriclayer, an etch mask having an opening; and etching the first low-kdielectric layer through the opening, thereby forming the first trenchthat spans from the first metal feature to the second metal feature in afirst direction and spans between the sidewalls of the first low-kdielectric layer in a second direction being different from the firstdirection.
 4. The method of claim 1, wherein the forming of first trenchin the first low-k dielectric layer includes: forming a second etch stoplayer over the first and second metal features and the first low-kdielectric layer; patterning the second etch stop layer to form anopening in the second etch stop layer, wherein the opening exposes thefirst low-k dielectric layer in a region between the first and secondmetal features; performing a dry etching process to the first low-kdielectric layer through the opening, using a fluorine-containingetchant; and performing a wet etching process to the first low-kdielectric layer through the opening.
 5. The method of claim 1, whereinthe performing of the UV treatment to the sidewalls of the first low-kdielectric layer is prior to the forming of the first etch stop layerand after the forming of the first trench in the first low-k dielectriclayer.
 6. The method of claim 1, wherein the performing of the UVtreatment to the sidewalls of the first low-k dielectric layer includesirradiating an UV radiation on to the sidewalls of the first low-kdielectric layer; and supplying a first gas containing a CH₃ chemicalgroup to the first low-k dielectric layer during the irradiating of theUV radiation.
 7. The method of claim 6, wherein the supplying of thefirst gas containing the CH₃ chemical group includes supplying a gasselected from the group consisting of a methylsilane (SiCH₆),dimethylsilane (SiC₂H₈), a trimethylsilan (SiC₃H₁₀), a tetramethylsilane(SiC₄H₁₂) and a combination thereof.
 8. The method of claim 7, whereinthe irradiating of the UV radiation to the sidewalls of the first low-kdielectric layer includes applying an UV radiation source having aspectrum to effectively break Si—CH₃ bond and O—H bond.
 9. The method ofclaim 6, wherein the performing of the UV treatment to the sidewalls ofthe first low-k dielectric layer further includes supplying a second gasto carry on the first gas to the sidewalls of the first low-k dielectriclayer, wherein the second gas is an inert gas selected from the groupconsisting of nitrogen and argon.
 10. The method of claim 1, wherein theforming of the first etch stop layer includes forming the first etchstop layer conformal to the first trench.
 11. The method of claim 1,further comprising a chemical mechanical polishing process to the secondlow-k dielectric layer after the depositing of the second low-kdielectric layer on the first etch stop layer.
 12. A method offabricating a semiconductor structure, comprising: forming a first low-kdielectric layer over a substrate; forming a first and second metalfeatures in the first low-k dielectric layer; forming a first trench inthe first low-k dielectric layer, the first trench spanning between thefirst and second metal features; irradiating an UV radiation tosidewalls of the first trench in the first low-k dielectric layer;supplying a first gas containing a CH₃ chemical group to the first low-kdielectric layer during the irradiating of the UV radiation; forming afirst etch stop layer in the first trench; and depositing a second low-kdielectric layer on the first etch stop layer, thereby forming an airgap in the first trench.
 13. The method of claim 12, wherein thesupplying of the first gas containing the CH₃ chemical group includessupplying a gas selected from the group consisting of a methylsilane(SiCH₆), dimethylsilane (SiC₂H₈), a trimethylsilan (SiC₃H₁₀), atetramethylsilane (SiC₄H₁₂) and a combination thereof.
 14. The method ofclaim 13, wherein the irradiating of the UV radiation to the sidewallsof the first low-k dielectric layer includes applying an UV radiationsource having a spectrum to effectively break Si—CH₃ bond and O—H bond.15. The method of claim 13, further comprising supplying a second gas tocarry on the first gas to the sidewalls of the first low-k dielectriclayer during the irradiating of the UV radiation, wherein the second gasis an inert gas selected from the group consisting of He, Ne, Ar, Kr,Xe, Rn, or a combination thereof.
 16. The method of claim 12, furthercomprising heating the semiconductor structure to a temperature rangingbetween 200° C. and 400° C., during the irradiating of the UV radiation.17. The method of claim 12, wherein the irradiating of the UV radiationincludes irradiating a first UV radiation form a first UV source with afirst UV spectrum to effectively break a Si—C bond of the first gas;irradiating a second UV radiation from a second UV source with a secondspectrum to effectively break an O—H bond of the low-k dielectric layer,wherein the second spectrum is different from the first spectrum. 18.The method of claim 17, wherein the first UV spectrum of the firstradiation has a first central frequency greater than the bond energy ofthe Si—CH₃ bond at about 310 KJ/mol; and the second UV spectrum of thefirst radiation has a first central frequency greater than the bondenergy of the O—H bond at about 459 KJ/mol.
 19. A method of fabricatinga semiconductor structure, comprising: forming a first low-k dielectriclayer over a substrate; forming a first and second metal features in thefirst low-k dielectric layer; forming a first trench in the first low-kdielectric layer, the first trench spanning between the first and secondmetal features; performing a ultraviolet (UV) treatment to sidewalls ofthe first low-k dielectric layer in the first trench; thereafter,forming a first etch stop layer in the first trench; and depositing asecond low-k dielectric layer on the first etch stop layer, therebyforming an air gap in the first trench, wherein the UV treatmentincludes irradiating an UV radiation to the sidewalls of the first low-kdielectric layer; supplying a first gas containing a CH₃ chemical groupto the first low-k dielectric layer during the irradiating of the UVradiation; and heating the semiconductor structure to a temperatureranging between 200° C. and 400° C., during the irradiating of the UVradiation.
 20. The method of claim 19, wherein the irradiating of the UVradiation to the sidewalls of the first low-k dielectric layer includesirradiating a first UV radiation form a first UV source with a first UVspectrum to effectively break a Si—C bond of the first gas; irradiatinga second UV radiation from a second UV source with a second spectrum toeffectively break an O—H bond of the first low-k dielectric layer,wherein the second spectrum is different from the first spectrum.